Equipment Capabilities
We invest in Technology that keeps Cyient DLM’s facility running efficiently, allowing us to consistently provide the best possible product to our customers.
Known for her problem-solving mindset, Nora views every challenge as a puzzle—digging into issues, uncovering opportunities, and partnering with cross-functional teams to drive meaningful improvement. She is committed to building robust processes that benefit both internal and external customers.
When she’s not at work, Nora enjoys being outdoors with her family. She spends her free time traveling, gardening, and bird watching.
Surface Mount Equipment and specifications:
Board Size Min = 50 mm x 50 mm (2” x 2”)
Board Size Max = 410 mm x 460 mm (16” x 18”)
Ball Grid Array and Advanced SMD’s
BGA’s (BGA placement up to 55mm² 1.0mm pitch)
Wave and Selective Soldering – Lead or Lead Free (RoHS)
Through-Hole assembly equipment
Board Size Min = 50 mm x 50 mm (2” x 2”)
Board Size Max = 350 mm x 460 mm (14” x 18”)
Inspection
Automated Optical Inspection
Board Size Min = 50 mm x 50 mm (2” x 2”)
Board Size Max = 410 mm x 460 mm (16” x 18”)
X-Ray Inspection
Automated Depaneling
Cleaning
Board Size Min = n/a
Board Size Max = 24 x 25”
PCB Conformal Coating and Potting
PCB Conformal Coating
Circuit Board Testing
Supporting Equipment
We invest in Technology that keeps Altek’s facility running efficiently, allowing us to consistently provide the best possible product to our customers.