Specific techniques are required for soldering high voltage through-hole terminations. The solder must be a smooth ball, without any sharp points. These sharp points (known as icicles) initiate corona discharges or arcing. Our soldering operators are certified to IPC-A-610 and the J-STD-001 and have years of experience with this technique.
Surface Mount Equipment and specifications:
Board Size Min = 50 mm x 50 mm (2” x 2”)
Board Size Max = 410 mm x 460 mm (16” x 18”)
Ball Grid Array and Advanced SMD’s
BGA’s (BGA placement up to 55mm² 1.0mm pitch)
Wave and Selective Soldering – Lead or Lead Free (RoHS)
Through-Hole assembly equipment
Board Size Min = 50 mm x 50 mm (2” x 2”)
Board Size Max = 350 mm x 460 mm (14” x 18”)
Inspection
Automated Optical Inspection
Board Size Min = 50 mm x 50 mm (2” x 2”)
Board Size Max = 410 mm x 460 mm (16” x 18”)
X-Ray Inspection
Automated Depaneling
Cleaning
Board Size Min = n/a
Board Size Max = 24 x 25”
PCB Conformal Coating and Potting
PCB Conformal Coating
Circuit Board Testing
Supporting Equipment
We invest in Technology that keeps Altek’s facility running efficiently, allowing us to consistently provide the best possible product to our customers.
